Technics capacity

Item Technics capacity
Layers 1--48
Material FR-4 、 Insulated Metal Substrate、High frequency material etc.　
Max. manufacturing size 500mm X1200mm
Outline tolerance ± 0.1mm
Board thickness range 0.20mm--8.00mm
Board thickness tolerance (t≥1.0mm) ± 10%
Board thickness tolerance(t＜1.0mm) ± 0.1mm
Core thickness 0.075mm--5.00mm
Min. trace width(HOZ base copper for outler layer ) 0.075 mm
Min. trace space(HOZ base copper for outler layer ) 0.075 mm
Min. trace width(1OZ base copper for outler layer ) 0.125 mm
Min. trace space(1OZ base copper for outler layer ) 0.125 mm
Min. trace width(2OZ base copper for outler layer ) 0.18 mm
Min. trace space(2OZ base copper for outler layer ) 0.18 mm
Min. trace width(3OZ base copper for outler layer ) 0.23 mm
Min. trace space(3OZ base copper for outler layer ) 0.23mm
Copper thickness for outer layers 35um--175um
Copper thickness for inner layers 17um--175um
Drilling holes size 0.10mm--6.35mm
Finish holes size 0.10mm--6.30mm
Hole size tolerance ±0.05mm
Hole position tolerance ±0.075mm
Aspect ratio 12:1(drill hole>0.30MM) , 8:1(drill hole≤0.30MM)
Solder mask type Liquid photoimageable solder resist ink
Solder mask color white、black、blue、green、yellow、red etc.
Min. solder mask bridge 0.125mm(black),other 0.10mm
Min. solder mask clearance ring
 0.05mm
Plug holes range 0.25mm--0.65mm
Impedance tolerance ± 10%
Au & Ni thickness for Immersion gold thickness Au thickness: 2~4U",Ni thickness: 120~200U
Au & Ni thickness for gold fingers Au thickness: 5~30U",Ni thickness: 120~200U
Copper in hole wall 20~25UM
Surface finish type Hasl/Lead free Hasl、Immersion gold、Immersion Tin、Immersion silver, OSP,etc