一种软硬结合覆铜板的制作方法 一种软硬结合覆铜板的制作方法

A method of making copper plate with soft and hard combination. combination.

 技术领域 Technical field ? [0001] 本发明涉及 PCB软硬结合板制造领域， 具体涉及到线路板厂或者覆铜板厂制造出软硬结合覆铜板的 方法。

[0001] the invention relates to the manufacturing field of PCB soft and hard binding plate, which is specifically related to the method of manufacturing soft and hard combined copper plates in the circuit board factory or copper plate factory.

背景技术

Technical background

[0002] 软硬结合电路板是指在一块印制板上包含有一个或多个刚性区和一个或多个软性区的电路板。

[0002] soft and hard binding circuit boards refer to a printed board containing one or more rigid areas and one or more flexible circuit boards. 

[0003] 软板的材料一般选用聚酰亚胺（ PI ）软性基材，聚酰亚胺是一种具有很好的可软性，优良的电气性 能和耐热的材料，但它具有较大的吸湿性和不耐强碱性。

[0003] soft plate material polyimide (PI) is generally selected soft base material, polyimide is a very good soft, excellent electrical properties and heat resistant material, but it has large hygroscopicity and not resistant to strong alkali. 

[0004] 刚性板的材料一般选用环氧树脂玻璃纤维布基材 FR-4 。

[0004] the material of rigid plate is usually made of epoxy resin glass fiber cloth substrate fr-4.

[0005] 一般的软硬结合板是先采用柔性覆铜板（ FCCL）制作软板，然后把软板加入到硬板中制作出软硬结合板。

[0005] the general soft and hard binding plate is made of flexible copper plate (FCCL), and then the soft board is added to the hard plate to make the soft and hard board.

[0006] 软板部分起到软连接（可以弯曲）的作用，硬板部分起到安装电子元器件的作用，软板部分是镂空 的。

[0006] the soft board part plays the role of soft connection (bending). The hard board part ACTS as an electronic component, and the soft plate is hollow. 

[0007] 软板材料和硬板材料因为材料特性的不同，在加工时需要特别对待，例如：化学铜不容易沉积到 PI 上、膨胀率不一样影响到曝光时对位精度、厚薄不一样，这些问题都会造成制作过程中的高难度。

[0007] soft plate materials and hard materials is different because the material properties, need special treatment during processing, for example: it is not easy to chemical copper deposition on the PI, is not the same as the inflation rate affect the exposure registration accuracy, when the thickness is different, these problems will cause the difficult in the process of production.

[0008] 现在通常的做法，是用孔来连接硬板层的线路和软板层的线路，而孔占据很大的表面积和体积，多 种材料的孔内质量是难以保证的。

[0008] now the usual practice is to use the hole to connect the line of the hardboard layer and the soft plate layer, while the hole occupies a large surface area and volume, and the quality of the holes in a variety of materials is difficult to guarantee.

[0009] 为了软硬结合板的轻薄短小和质量可靠性的考虑，需要尽量减少制作在软板 PI 材料上的孔连接， PI 材料和 FR-4 材料结合处的线路适合采用面连接方式，这就需要一种软硬结合的覆铜板。

[0009] in order to combine hard and soft board quality of lightweight and considering the reliability of the need to minimize the production on the soft board PI material hole connection, PI material and FR - 4 junction line is suitable for using surface connection, which requires a combination of hard and soft copper clad. ? 发明内容 The invention content

[0010] 本发明的目的是提供一种制造软硬结合覆铜板的方法，为软硬结合板的制造提供高效率、低成本、 高可靠性的基础材料。

[0010] the purpose of the present invention is to provide a method for manufacturing soft and hard combined copper plate, which provides a high efficiency, low cost and high reliability base material for the manufacturing of soft and hard bonded plates.

[0011] 本发明的绝缘层介质是由软性材料和硬性材料共同组成的，硬性材料用在软硬结合板的硬性部分， 软性材料用在需要弯折的部分。

[0011] the insulating medium of the invention is composed of soft materials and hard materials. The hard materials are used in hard parts of the hard and soft binding boards, and the soft materials are used in the parts that need to be bent.

[0012] 软性材料向硬板内延伸 1mm以上，优选 2.5mm以上，以保证软硬结合处的牢固；

[0012] the soft material extends over 1mm to the hardboard, preferably more than 2.5mm, to ensure the firmness of the soft and hard joint; 

并且软性部分不需要钻孔，以减小孔连接方式所带来的加工难度。

And the soft part does not need drilling, to reduce the hole connection mode of the processing difficulty.

[0013] 由硬性部分的半固化片 （ PP) 提供的树脂填充软硬结合处的缝隙， 硬性部分的树脂与铜箔直接粘合；

[0013] the resins supplied by the hard part of the semi-cured film (PP) fill the gap in the soft and hard joint, and the hard part of the resin is directly bonded with the copper foil.

软性部分采用粘合剂与铜箔粘合。

The soft part is glued together with copper foil. 

[0014] 本发明的方法步骤是：

[0014] the method of the invention is:

步骤 A、在纯软性材料 (PI) 上整体涂覆一层预固化粘合剂， 粘合剂优先选用热固性环氧树脂改性聚酰亚胺。

Step A: apply A layer of precuring adhesive to the pure soft material (PI). The adhesive is preferred to the thermosetting epoxy resin modified polyimide.

[0015] 步骤B、根据所需要的软硬结合覆铜板的软性部分的形状，切割涂覆了预固化粘合剂的软性材料， 优先采用激光切割方式。

[0015] step B, according to the required soft and hard combination of the soft parts of the copper plate, cut the soft material with precurable adhesive, and the laser cutting mode is preferred. 

[0016] 步骤C、根据所需要的软硬结合覆铜板的形状，切割硬板部分的半固化片（ PP），优先采用激光切 割方式和冲切方式。

[0016] step C, according to the required soft and hard combination of copper plate shape, cut the hard plate part of the semi-cured film (PP), first adopt the laser cutting mode and the cutting mode. 

[0017] 步骤D、把切割好的 PI 和 PP采用拼图的方式组合在一起，双面覆盖铜箔或者单面覆盖铜箔，单面 覆盖铜箔时另一面使用离型膜。

[0017] step D, put the cut PI and PP together in the form of a jigsaw, covered with copper foil or single side covering copper foil, while the other side of the copper foil is covered with the separation film. 

[0018] 步骤E、把覆盖了铜箔的组合体放入真空压合机进行层压，完成软硬结合覆铜板的制作。

[0018] step E, put the composite coated copper foil into the vacuum press to carry out lamination, and finish the production of soft and hard combined copper plate. 

[0019] 以上制作出来的软硬结合覆铜板可以直接像多层板内层芯板那样使用。

[0019] the combined soft and hard copper clad plates can be used directly like the inner core plate of the multi-layer board. 

[0020] 软硬结合处在层压时会产生部分偏移，一般偏移量小于 1mm，因为软板部分向硬板中有部分延伸， 所以这种偏移量是允许的。

[0020] when the soft and hard combination is in laminar pressure, partial deviation is generated. The general offset is less than 1mm, because the soft plate is partially extended to the hardboard, so this offset is allowed. 

[0021] 这种方法是在制做覆铜板基材的时候就完成了软硬结合， 而不是在制作硬板的过程中完成软硬结合。

[0021] this method is done in the process of making copper-clad base materials, rather than in the process of making hard plates. ? 附图说明 The appended drawings show ?

[0022] 附图1 是双面敷铜软硬结合基材截面图。

[0022] FIG. 1 is a cross-sectional drawing of double-sided copper and soft and hard combined base material. 

[0023] 附图标记说明：

[0023] attached map marking:

第一铜箔层 101 ，第一粘合层 102 ，硬性材料层 103 ，软性材料层 104 ，第二铜箔层 201 ，第二粘合层 202 。

The first copper foil layer 101, the first bonding layer 102, the hard material layer 103, the soft material layer 104, the second copper foil layer 201, the second glue layer 202.

[0024] 附图2 是单面敷铜软硬结合基材截面图。

[0024] attached FIG. 2 is a cross-sectional drawing of a single surface copper clad soft and hard combined with a base material. 

[0025] 附图标记说明：

[0025] attached map marking: 

铜箔层 101 ，粘合层 102 ，硬性材料层 103 ，软性材料层 104 ，补强材料层 105 。

Copper foil 101, adhesive layer 102, hard material layer 103, soft material layer 104, reinforcing material layer 105.

具体实施方式

Specific implementation mode 

[0026] 具体实施方式 1：

[0026] specific implementation mode 1:

 以下按照附图 1 详细说明双面敷铜软硬结合板的具体实施方式。

According to the attached figure 1, the concrete implementation mode of the double-sided copper and hard bonded plate is described in detail.

[0027] 步骤A、在 0.1mm厚度的 PI 软性材料层 104 上两面滚涂一层厚度为 12-18um 的粘合剂，粘合剂采 用热固性环氧树脂改性聚酰亚胺。

[0027] step A, on the PI soft material layer of 0.1mm thickness, roll the adhesive with A thickness of 12-18um on both sides, and the adhesive is modified polyimide with thermosetting epoxy resin. 

[0028] 具体粘合剂的型号为 Q-AD-X1404 ，喷涂了粘合剂之后进行预烤，条件为：

[0028] the model of the specific adhesive is q-ad-x1404, which is pre-baked after spraying the adhesive. The conditions are as follows: 

90℃× 3min+120 ℃× 3min+150 ℃× 3min ； 90 ℃ * 3 min + 3 min + 120 ℃, 150 ℃ x 3 min.

预烤之后的第一粘合层 102 和第二粘合层 202 各自的厚度为 2-3um 。

The first bonding layer 102 and the second glue layer 202 each have a thickness of 2-3um.

[0029] 步骤B、根据所需要的软硬结合覆铜板的软性部分的形状，采用激光切割方式切割涂覆了预固化粘 合剂的软性材料，。

[0029] step B, according to the required soft and hard combination of the soft part of the copper plate, adopts the laser cutting method to cut the soft material of the precurable adhesive.

[0030] 步骤C、根据所需要的软硬结合覆铜板的形状，采用激光切割方式切割准备作为硬性材料层 103 的 半固化片（PP），半固化片采用 S1000B，厚度 0.10mm，玻璃布型号为 2313，含胶量 58%。

[0030] step C, according to the need of the shape of a combination of hard and soft copper clad, with laser cutting way cutting prepared as hard material layer 103 half curing (PP), half cured by S1000B, thickness of 0.10 mm, glass cloth models for 2313, 58% rubber content. 

[0031] 步骤D、把切割好的涂覆好预固化粘合剂的 PI 软性材料层 104 和 PP硬性材料层 103 ，采用拼图的 方式组合在一起，双面覆盖 18um的压延铜箔第一铜箔层 101 和第二铜箔层 201，铜箔表面预先经过棕化处 理。

[0031] step D, the cutting good coating curing adhesive PI soft material 104, 104 and PP hard material layer with the method of the puzzle together, double-sided 18 um first rolled copper foil copper foil layer, 201, 101 and the second copper foil layer copper foil surface after brown in advance. 

[0032] 步骤E、把覆盖了铜箔的组合体放入真空压合机进行层压，完成软硬结合覆铜板的制作。

[0032] step E, put the composite coated copper foil into the vacuum press to carry out lamination, and finish the production of soft and hard combined copper plate.

[0033] 真空层压的参数为： [0033] the parameters of vacuum layer pressure are: 

温度： 190 ℃， 60分钟以上； Temperature: 190 ℃, 60 minutes;

压强： 3MPa。 Pressure: 3MPa.

[0034] 具体实施方式 2：

[0034] concrete implementation mode 2:

以下按照附图 2 详细说明双面敷铜软硬结合板的具体实施方式。

According to the attached figure 2, the concrete implementation mode of double-sided copper and hard bonded plate is described in detail. 

[0035] 步骤A、在 0.1mm厚度的 PI 材料 104 上单面滚涂一层厚度为 12-18um的粘合剂，粘合剂采用热固 性环氧树脂改性聚酰亚胺。

[0035] step A, on the PI material 104 with A thickness of 0.1mm, the single-side roller coating is A binder with A thickness of 12-18um, and the binder is modified polyimide with thermosetting epoxy resin.

[0036] 具体粘合剂的型号为 Q-AD-X1404 ，滚涂了粘合剂之后进行预烤，条件为：

[0036] the model of the specific adhesive is q-ad-x1404. After the adhesive is rolled, it is pre-baked with the following conditions:

90℃× 3min+120 ℃× 3min+150 ℃× 3min ； 90 ℃ * 3 min + 3 min + 120 ℃, 150 ℃ x 3 min. 

预烤之后的粘合层 102 的厚度为 2-3um 。 The thickness of the adhesive layer 102 after pre-baking is 2-3um. 

[0037] 步骤B、根据所需要的软硬结合覆铜板的软性部分的形状，采用激光切割方式切割涂覆了预固化粘 合剂的软性材料，。

[0037] step B, according to the required soft and hard combination of the soft part of the copper plate, adopts the laser cutting method to cut the soft material of the precurable adhesive.

[0038] 步骤C、根据所需要的软硬结合覆铜板的形状，采用激光切割方式切割准备作为硬性材料层 103 的 半固化片（PP），半固化片采用 S1000B，厚度 0.10mm，玻璃布型号为 2313，含胶量 58%。

[0038] step C, according to the need of the shape of a combination of hard and soft copper clad, with laser cutting way cutting prepared as hard material layer 103 half curing (PP), half cured by S1000B, thickness of 0.10 mm, glass cloth models for 2313, 58% rubber content. 

[0039] 步骤D、把切割好的 PI 软性材料层和 PP硬性材料层 103 ，采用拼图的方式组合在一起，有粘合层 102 的那一面覆盖 18um的压延铜箔，铜箔表面预先经过棕化处理；

[0039] step D, the cutting good PI soft material and PP hard material layer 103, with the method of the puzzle together, 102 glue layer side covers 18 um rolled copper foil, copper foil surface after brown treated in advance;

没有粘合层的那一面覆盖离型膜。

The side that has no adhesive layer covers the dissection membrane. 

[0040] 步骤E、把覆盖了铜箔和离型膜的组合体放入真空压合机进行层压，完成单面软硬结合覆铜板的制 作。

[0040] step E, put the combination of copper foil and the separation membrane into the vacuum press to carry out lamination, and complete the production of single surface soft and hard combined copper plate.

[0041] 真空层压的参数为：

[0041] the parameters of vacuum layer pressure are: 

温度： 190 ℃， 60分钟以上；

Temperature: 190 ℃, 60 minutes;

压强： 3MPa 。 Pressure: 3MPa.

[0042] 软硬结合覆铜板在层压完成后根据需要增加补强材料层 105 ，补强材料层用相应尺寸的低流胶 PP， 可以单独预贴在软硬结合覆铜板上；

[0042] according to the need to increase the reinforcement material layer 105 after the lamination is completed, the reinforced material layer can be pre-attached to the copper plate on the soft and hard combination with the corresponding size of the low-flow glue PP.

也可以在制作软硬结合板时压合在多层板上。

It can also be pressed on the multilayer board when making the soft and hard binding board.

[0043] 本发明除了可以在绝缘层上单面或者双面压合铜箔，还可以涂覆或者化学沉积、物理溅射铜层，实 现软硬结合覆铜板的制造。

[0043] the invention can be applied to the manufacturing of soft and hard copper clad laminates in addition to a single or double-sided copper foil on the insulation layer, and can also be coated or chemically deposited and physically sputtered into the copper layer.

[0044] 直接采用软硬结合覆铜板为基材制造软硬结合板， 实现软硬结合处的线路是面连接方式， 采用硬板 的制造工艺和设备就可以方便地制造出软硬结合板。

[0044] directly USES the combination of hard and soft copper clad plate for base material manufacturing soft hard couple, achieve soft hard surface is the junction line connection mode, adopt hard board manufacturing process and equipment can easily create a combination of hard and soft board. 

[0045] 本发明只是对一种软硬结合覆铜板基础材料的制作方法的描述， 可以按照本发明进行软硬结合板的 制造，在线路板制造和覆铜板材料制造领域，本发明在具体的实施方式和应用范围上会有改变之处，所以 本说明书内容不应理解为对本发明的限制。

[0045] the invention only on a combination of hard and soft copper clad description of the method of making the base material, can be carried out in accordance with the present invention combines hard and soft board manufacturing, in the field of circuit board manufacturing and copper clad materials, the implement method of the invention in the concrete and the application will have change, so this manual content should not be interpreted as limiting the invention.

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