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USB3.0 pcb基板

Product Name: USB3.0 PCB substrate

Plate: Shengyi SI10U

Minimum line width / line spacing: 90 / 30um

Number of layers: 4layers

Package size: 11.3x24.8mm

Surface technology: soft gold

Copper thickness: 0.5oz

Plate thickness: 0.25mm

Purpose: USB3.0

Shengyi SI10U features: low CTE, high modulus, can effectively reduce the warpage of packaging substrate, excellent heat and moisture resistance, good PCB processability, halogen-free material, tg270

Download Shengyi SI10U material specification

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