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Product Name: BGA IC Substrate PCB
Plate: Shengyi SI643HU
Minimum line width / line spacing: 30 / 30um
Number of layers: 4layers
Surface technology: nickel palladium (ENEPIG)
Plate thickness: 0.48mm
Purpose: electronic products BGA IC packaging substrate
Product features:
1. Package size 3 * 3mm to 15 * 15mm
2. The minimum line width and distance is 30 * 30um
3. The span of small bump is 130um
4. 2-12 floor structure
5. Small size package
Shengyi SI643HU features: TG 245 ℃ (DMA), low XY axis / Z axis CTE and higher modulus, excellent drilling processability, halogen-free environmental protection materials, suitable for lead-free process, in line with ROHS / WEEE
Download Shengyi SI643HU material specification
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